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  X-RAY INSPECTION SYSTEM

 

 

Home > Inspection System > VHR X-RAY 검사  

 

 

     

 

 

VHR X-RAY 검사시스템

(Very High Resoultion X-Ray INPECTION SYSTEM)

 

 

The VHR 3x1 X-ray Inspection system is a very high resolution large area X-ray CCD array detector system that incorporates 3 tapered X-ray CCD modules.

 

The Inspection system is composed with three individual tapered CCD modules, each with 4008 x 2672 resolution and 124x83mm active area.

The camera produces a 250x125mm 33 megapixel resolution image with 31 microns pixel size.

The 3 sensors are multiplexed in order to deliver a seamlessly stitched image at the user interface in 1,1 second with the option of further processing such as auto flat field and offset correction.

Other geometries with 375x83mm, or 166x125mm up to 250x83mm are available for tiled CT reconstruction.

Acquisition routines including expose while read out enables to achieve 100% duty cycle for continuous sample rotation / CT.

Resolution up to 48 megapixels can be achieved with three 16 megapixel sensors, including customized scintillators for optimum resolution and energy operation.

 

 

적용분야

 

• Microdiffraction

• X-ray imaging

• X-ray micro CT

• Laue imaging

• Protein crystallography at up to 50 keV

• Gisaxs

• Powder Diffraction

• Non Destructive Testing

• Phase Contrast Imaging

• Small animal imaging

 

 

특징 및 장점 (ADVANTAGES)

 

Small pixel size less < 32 microns pixel size at the detector input

Cooled CCD sensor with 55 degrees C delta T

2x20MHz multiplexed scanning frequency

Large area sensor with slot or tiled array geometry

Seamless large fibre optic input

Low readout noise < 15 electrons with noise interpolation reduction

Very low dark current with less than 0.05 electrons per pixel per second

  (cooling options for further noise reduction).

Gating time from milliseconds to > 30 minutes

Simultaneous integration / readout enabling 100% duty cycle acquisition

Dual tap readout for fast acquisition

GdOS polycrystalline or structured CsI scintillators

On chip binning

Detector synchronisation : pixel locked for dual channel acquisition

Camera link and GigE digital interface

Peltier / fan cut off option

Low profile electronics

Air cooled / water cooled option

 

 

기술 사양 (SPECIFICATIONS)

X-ray 22 megapixel CCD camera

X-ray 32 megapixel CCD camera

· 4008 (h) x 5344 (v) CCD array

· 9744 (h) x 3248 (v) CCD array

· Input pixel size: 31.18 x 31.18 microns

· Input pixel size: 25.63 x 25.63 microns

· 124.96 x 166.14 mm (tiled array)

· 250 x 83.07 mm (slot array)

· 1.8 fps at full resolution @ 20 MHz

· 1.1 fps at full resolution @ 2x20 MHz

· 5 fps in binning 4x4 @ 1002 x 1336 resolution

· 3 fps in binning 4x4 @ 2436 x 812 resolution

· Readout noise : 14-18 electrons @ 20 MHz

  with interpolation noise reduction

· Readout noise: 12-16 electrons @ 2x20 MHz

  with interpolation noise reduction

· Full well capacity : 45,000 electrons in binning

  1x1; 90,000 electrons in binning 2x2

· Full well capacity : 25,000 electrons in binning

  1x1 - 50,000 electrons in binning 2x2

· Dark current : < 0,05 electrons / pixel /

  second isation / control : via TTL pulse or

  pixel clock

· Dark current : 0,05 electrons / pixel / second

· 12-bit digitisation

· 12-bit digitisation

· 16-bit extended dynamic range

· 16-bit extended dynamic range

· GdOS:Tb scintillator for operation from 5-55 keV  with minimum feature recognition of 10lp/mm :  typically 50 microns.

· Camera link / GigE interface

· CsI:Tl structured scintillator for operation from

  30-100 keV

· Synchronisation / control : via TTL pulse or

  pixel clock

· Camera link / GigE interface

 

· Synchron

 

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상기 사양은 제품의 성능향상 및 개량을 위하여 변경될 수 있으며, 요청사양은 적용분야에 따라 당사 기술팀과 협의 후 추가 설치 가능하므로, 시스템에 대한 상세한 사양은 당사 영업팀과 상세하게 협의하시기 바랍니다.

 

  

 

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경기도 시흥시 정왕천로 197, A-512 (정왕동  동우디지털파크)   |  E-mail : contact@dtx.co.kr  

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