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  X-LIGHT SINTERING (광신터링)

 

 

  Home > Surface Treatment > Photonic Curing  

 

 

     

 

 

X-LIGHT 광소결 / 광신터링 시스템 (X-LIGHT SINTERING SYSTEM)

PHOTONIC CURING (SINTERING) TECHNOLOGY

 

 

시스템 외관 (APPEARENCE)

 

 

Model : S-5100 

S-5100 Photonic Sintering System (광소결시스템)

 

 

Model : S-2300 

 

 

 

Photonic Sintering System - Dual Pulse Type

 

 

Model : S-2100 

Photonic Sintering System (광신터링 시스템)

X- Light Photonic Curing System

 

  

 

 

 

Model : S-2200 

PLS-2200 광소결시스템 PLS-2200 광소결시스템

 

 

Model : X-1100 (실험용)

PLX-1100 광소결시스템

 

 

 

X- Light Photonic Curing System

 

 

 

 

 

 

 

 

 

SIGNIFICANCE OF NANOPARTICLES

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  • All materials have basic properties
  • Melting point, light absorption (color) etc.
  • Governed by laws of particle physics
  • These are independent of particle size
  • Melting point for a gram of copper is the same as for a kg of Copper.  It still looks like the same material
  • Once materials become around the size of 1 to 100 nanometers  quantum physics becomes significant
  • Their Melting point changes
  • Optical absorption characteristics change: Quantum Dots
  • Opens up new possibility of sintering at significantly lower  temperature when compared to bulk material.
  • Gold 1064 C bulk 300 C when 25nm     

  

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CONDUCTIVE NANO PARTICLE INKS

 

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  • Basic Principle
  • Start with nanoparticle conductive ink
  • Deposit on substrate
  • Use low temperature to achieve sinter
  • Convert to Bulk conductive material,
  • nanoparticle properties change
  • Melting point, color etc.
  • Two different categories of conductive nano inks
  • Basic Sintering –e.g. Silver
  • Reduction and Sintering –e.g. Copper
  • Why Sinter Conductive Inks
  • Melting point of metals are usually higher than plastics (the substrate)
  • Would make conductive traces (printed circuits) onflexible materials
  • Could be applied by regular printing process like  roll to roll or inkjet.

 

 

SINTERING SILVER NANO PARTICLES

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  • Silver is relatively easy to sinter
  • Silver is Conductive as is Silver Oxide
  • Nanomaterial is easy(er) to produce
  • Yield is high even if bulk is expensive
  • Energy required is low nanoparticle size 5-
  • Traditional process.
  • Use 120 C thermal for around 10 minutes.
  • Shiny finish good conductivity.
  • Using X-Light Lamp
  • Excellent Conductivity
  • Matt finish due to rapid formation

 

 

 

 

 

COPPER SINTERING

 

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  • Copper Is harder to sinter
  • Copper is conductive, Copper oxide not a good conductor. Copper readily oxidizes
  • Nanomaterials are harder to produce
  • Yield is low even if bulk is cheaper
  • Energy required is significantly higher
  • Is the “Holy Grail” for Printed electronics technology
  • Typically Sintering also requires a reduction of copper oxide to copper.
  • Some Oxidizing material in the ink may be required
  • Small margin between energy to sinter and energy to evaporate material

 

 

 

 

 

 

COPPER CIRCUITS–BEFORE & AFTER SINTERING

 

 

Phtonic sintering of nanoparticle inks on flexible circuits 

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MEETING THE NEEDS OF HIGH SPEED PRINTING

 

 

  • In addition to low temperature curing, there are additional benefits of X-Light curing that make it suitable for printable electronics.
  • By reducing the time to cure milliseconds, X-Light curing can be compatible with high-speed printing processes such as gravure and flexography without a large amount of dedicated floor space. In essence, the time to cure becomes matched to the time to print.
  • The process is suited to nanoparticle-based materials, which also makes it well-suited to high resolution deposition methods and applications.
  • The speed with which sintering occurs makes it possible to cure copper in air, which normally must be cured in an inert or reducing environment.
  • Once a material has been sintered, it will typically no longer absorb light. Thus there is the potential for building multilayer circuitry that does not thermally stress the underlying layers.

 

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TEL : 031-497-1134

  

 

 

 

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FEATURED PRODUCTS

 

 

◎  UV CURING SYSTEM

   ◎   INFRARED DRYING SYSTEM

   ◎  PULSE UV SYSTEM

◎  OPTICAL INSTRUMENTS

   ◎   PHOTONIC SINTERING SYSTEM

   ◎  X-UV SYSTEM

◎  SOLAR SIMULATION SYSTEM

   ◎   WEATHER / FADE TESTING SYSTEM

   ◎  PULSE UV STERILIZATION SYSTEM

◎  XENON IRRADIATION SYSTEM

   ◎   ENGINEERING

   ◎  INSPECTION SYSTEM

◎  LIGHT SOURCE

   ◎   PHOTONIC ACTIVATION SYSTEM